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TC4423A资料

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TC4423A/TC4424A/TC4425A

3A Dual High-Speed Power MOSFET Drivers

Features

•High Peak Output Current: 4.5A (typical)•Wide Input Supply Voltage Operating Range:-4.5V to 18V

•High Capacitive Load Drive Capability:-1800pF in 12ns

•Short Delay Times: 40ns (typical)•Matched Rise/Fall Times•Low Supply Current:

-With Logic ‘1’ Input – 1.0mA (maximum)-With Logic ‘0’ Input – 150µA (maximum)•Low Output Impedance: 2.5Ω (typical)

•Latch-Up Protected: Will Withstand 1.5A Reverse Current

•Logic Input Will Withstand Negative Swing Up To 5V

•Pin compatible with the TC4423/TC4424/TC4425 and TC4426A/TC4427A/TC4428A devices

•Space-saving 8-Pin 150 mil body SOIC and 8-Pin 6x5 DFN Packages

General Description

The TC4423A/TC4424A/TC4425A devices are a familyof dual-output 3A buffers/MOSFET drivers. Thesedevices are improved versions of the earlier TC4423/TC4424/TC4425 dual-output 3A driver family. Thisimproved version features higher peak output currentdrive capability, lower shoot-throught current, matchedrise/fall times and propagation delay times. TheTC4423A/TC4424A/TC4425A devices are pin-compatible with the existing TC4423/TC4424/TC4425family. An 8-pin SOIC package option has been addedto the family. The 8-pin DFN package option offersincreased power dissipation capability for drivingheavier capacitive or resistive loads.

The TC4423A/TC4424A/TC4425A MOSFET driverscan easily charge and discharge 1800pF gatecapacitance in under 20 ns, provide low enoughimpedances in both the on and off states to ensure theMOSFET’s intended state will not be affected, even bylarge transients.

The TC4423A/TC4424A/TC4425A inputs may bedriven directly from either TTL or CMOS (2.4V to 18V).In addition, the 300 mV of built-in hysteresis providesnoise immunity and allows the device to be driven fromslow rising or falling waveforms.

The TC4423A/TC4424A/TC4425A dual-output 3AMOSFET driver family is offerd with a -40oC to +125oCtemperature rating, making it useful in any widetemperature range application.

Applications

••••

Switch Mode Power SuppliesPulse Transformer DriveLine Drivers

Direct Drive of Small DC Motors

Package Types

8-Pin PDIP/SOICTC4423ATC4424ATC4425A

NCIN AGNDIN B

182TC4423A73TC4424ATC4425A516-Pin SOIC (Wide)

NCIN ANCGNDGNDNCIN BNC

12345678161514131211109TC4423ATC4424ATC4425A

NCOUT AOUT AVDDVDDOUT BOUT BNC

NCOUT AVDDOUT BNCOUT AVDDOUT BNCOUT AVDDOUT B

TC4423ATC4424ATC4425A

8-Pin 6x5 DFN (1)

NC1IN A2GND3IN B4

TC4423ATC4424ATC4425A

8765

TC4423ATC4424ATC4425A

NCOUT AVDDOUT B

Note1:Exposed pad of the DFN package is electrically isolated.

2:Duplicate pins must both be connected for proper operation.

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TC4423A/TC4424A/TC4425A

Functional Block Diagram(1)

Inverting

750µA 300mV

VDD

Output

Input

Effective Input C = 20pF (Each Input)

GND

4.7V

Non-inverting

TC4423A Dual Inverting TC4424A Dual Non-inverting

TC4425A Inverting / Non-inverting

Note1:Unused inputs should be grounded.

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TC4423A/TC4424A/TC4425A

1.0

ELECTRICAL

CHARACTERISTICS

† Notice: Stresses above those listed under \"MaximumRatings\" may cause permanent damage to the device. This isa stress rating only and functional operation of the device atthose or any other conditions above those indicated in theoperational sections of this specification is not intended.Exposure to maximum rating conditions for extended periodsmay affect device reliability.

Absolute Maximum Ratings †

Supply Voltage................................................................+20VInput Voltage, IN A or IN B..........(VDD + 0.3V) to (GND – 5V)Package Power Dissipation (TA=50°C)

8L PDIP.......................................................................1.2W8L SOIC.................................................................... 0.61W16L SOIC.....................................................................1.1W8L DFN.................................................................... Note3

DC CHARACTERISTICS(NOTE2)

Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V.

Parameters

Input

Logic ‘1’, High Input VoltageLogic ‘0’, Low Input VoltageInput CurrentInput VoltageOutput

High Output VoltageLow Output VoltageOutput Resistance, HighOutput Resistance, LowPeak Output CurrentLatch-Up Protection With-stand Reverse CurrentSwitching Time (Note1)Rise TimeFall TimeDelay TimeDelay TimePower SupplySupply VoltagePower Supply CurrentNote1:

2:3:

VDDISIS

4.5——

—1.00.15

182.00.25

VmAmA

VIN = 3V (Both inputs)VIN = 0V (Both inputs)

tRtFtD1tD2

————

12124041

21214848

nsnsnsns

Figure4-1, Figure4-2, CL = 1800pF

VOHVOLROHROLIPKIREV

VDD – 0.025

—————

——2.22.84.5>1.5

—0.0253.03.5——

VVΩΩAA

DC TestDC Test

IOUT = 10mA, VDD = 18VIOUT = 10mA, VDD = 18V10V≤ VDD ≤18V (Note 2)Duty cycle ≤ 2%, t ≤ 300µsec.

VIHVILIINVIN

2.4—–1-5

1.51.3——

—0.81VDD+0.3

VVµAV

0V ≤ VIN ≤ VDD

Sym

Min

Typ

Max

Units

Conditions

Switching times ensured by design.

Tested during characterization, not production tested.

Package power dissipation is dependent on the copper pad area on the PCB.

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TC4423A/TC4424A/TC4425A

DC CHARACTERISTICS(OVER OPERATING TEMPERATURE RANGE)

Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ VDD ≤ 18V.

Parameters

Input

Logic ‘1’, High Input VoltageLogic ‘0’, Low Input VoltageInput CurrentOutput

High Output VoltageLow Output VoltageOutput Resistance, HighOutput Resistance, LowSwitching Time (Note1)Rise TimeFall TimeDelay TimeDelay TimePower SupplyPower Supply Current

——

2.00.2

3.00.3

VIN = 3V (Both inputs)VIN = 0V (Both inputs)

tRtFtD1tD2

————

20225050

31316666

nsnsnsns

Figure4-1, Figure4-2, CL = 1800pFFigure4-1, Figure4-2, CL = 1800pFFigure4-1, Figure4-2, CL = 1800pFFigure4-1, Figure4-2, CL = 1800pF

VOHVOLROHROL

VDD – 0.025

———

——3.13.7

—0.02567

VVΩΩ

IOUT = 10mA, VDD = 18VIOUT = 10mA, VDD = 18V

VIHVILIIN

2.4—–10

———

—0.8+10

VVµA

0V ≤ VIN ≤ VDD

Sym

Min

Typ

Max

Units

Conditions

Note1:Switching times ensured by design.

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.

Parameters

Temperature Ranges

Specified Temperature Range (V)Maximum Junction TemperatureStorage Temperature RangePackage Thermal ResistancesThermal Resistance, 8L-6x5 DFNThermal Resistance, 8L-PDIPThermal Resistance, 8L-SOICThermal Resistance, 16L-SOIC

θJAθJAθJAθJA

————

33.284.616390

————

°C/W°C/W°C/W°C/W

Typical four-layer board with vias to ground plane

TATJTA

–40—–65

———

+125+150+150

°C°C°C

Sym

Min

Typ

Max

Units

Conditions

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TC4423A/TC4424A/TC4425A

2.0

Note:

TYPICAL PERFORMANCE CURVES

The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.

8070Rise Time (ns)504030201004681012141618Supply Voltage (V)470 pF3,300 pF1,800 pF1,000 pF80704,700 pF4700 pF3300 pFFall Time (ns)606050403020100461000 pF1800 pF470 pF81012141618Supply Voltage (V)FIGURE 2-1:Voltage.

6050Rise Time (ns)403020100100Rise Time vs. Supply

FIGURE 2-4:Voltage.

7060Fall Time vs. Supply

5V10VFall Time (ns)5V504030201015V10V15V1000Capacitive Load (pF)1000001001000Capacitive Load (pF)10000FIGURE 2-2:Load.

242220Time (ns)1816141210-40-25-105tRISEtFALLRise Time vs. Capacitive

FIGURE 2-5:Load.

145Propagation Delay (ns)Fall Time vs. Capacitive

CLOAD = 1800 pFVDD = 12V125105856525tD2tD1CLOAD = 1800 pF203550658095110125Temperature (C)o23456710Input Amplitude (V)FIGURE 2-3:Temperature.

Rise and Fall Times vs.

FIGURE 2-6:Amplitude.

Propagation Delay vs. Input

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TC4423A/TC4424A/TC4425A

Typical Performance Curves (Continued)

Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.

100Propagation Delay (ns)tD1tD2Propagation Delay (ns)9080706050403046CLOAD = 1800 pF7065605550403530CLOAD = 1800 pFVDD = 18VVIN = 5VtD2tD181012141618-40-25-10520355065o8095110125Supply Voltage (V)Temperature (C)FIGURE 2-7:Supply Voltage.

0.5Quiescent Current (mA)Propagation Delay Time vs.

FIGURE 2-10:Temperature.

0.5Quiescent Current (mA)Propagation Delay Time vs.

VDD = 18VVDD = 18VBoth Inputs = 10.40.30.20.104681012141618Supply Voltage (V)Both Inputs = 0Both Inputs = 10.40.30.2Both Inputs = 00.10-40-25-105203550658095110125Temperature (oC)FIGURE 2-8:Supply Voltage.

76Quiescent Current vs.

FIGURE 2-11:Temperature.

8Quiescent Current vs.

TJ = 150oCVIN = 5V (TC4424A)VIN = 0V (TC4423A)7ROUT-HI (:)632TJ = 150CoVIN = 0V (TC4424A)VIN = 5V (TC4423A))ROUT-LO (:3214681012141618Supply Voltage (V)TJ = 25oCTJ = 25oC4681012141618Supply Voltage (V)FIGURE 2-9:Output Resistance (Output Low) vs. Supply Voltage.FIGURE 2-12:Output Resistance (Output High) vs. Supply Voltage.

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TC4423A/TC4424A/TC4425A

Typical Performance Curves (Continued)

Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.120Supply Current (mA)100806040200100400 kHz200 kHzVDD = 18V650 kHz50 kHz100 kHz1009080706050403020100VDD = 18V10,000 pF4,700 pFSupply Current (mA)470 pF1,800 pF1,000 pF100 pF1000Capacitive Load (pF)1000010100Frequency (kHz)1000FIGURE 2-13:Capacitive Load.

140Supply Current (mA)120100806040201 MHz500 kHzSupply Current vs.

FIGURE 2-16:Frequency.

140Supply Current (mA)12010080604020010Supply Current vs.

VDD = 12V100 kHz2 MHz200 kHzVDD = 12V10,000 pF4,700 pF1,800 pF1,000 pF470 pF100 pF01001000Capacitive Load (pF)10000100100010000Frequency (kHz)FIGURE 2-14:Capacitive Load.

120Supply Current (mA)100806040200100500 kHzSupply Current vs.

FIGURE 2-17:Frequency.140Supply Current (mA)Supply Current vs. VDD = 6V3.5 MHz2 MHz100 kHz200 kHz1 MHzVDD = 6V12010080604020010100100010,000 pF4,700 pF1,800 pF1,000 pF100 pF470 pF1000Capacitive Load (pF)1000010000100000Frequency (kHz)FIGURE 2-15:Capacitive Load.

Supply Current vs.

FIGURE 2-18:Frequency.

Supply Current vs.

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TC4423A/TC4424A/TC4425A

Typical Performance Curves (Continued)

Note: Unless otherwise indicated, TA = +25°C with 4.5V <= VDD <= 18V.

1.00E-06-610Crossover Energy (A*sec)1.00E-0710-71.00E-0810-81.00E-0910-94681012141618Supply Voltage (V)Note:The values on this graphrepresents the loss seen by bothdrivers in a package during onecomplete cycle. For a single driver,divide the stated values by 2. For asingle transition of a single driver,divide the stated value by 4.Crossover Energy vs.

FIGURE 2-19:Supply Voltage.

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TC4423A/TC4424A/TC4425A

3.0

PIN DESCRIPTIONS

PIN FUNCTION TABLE (1)

8-PinDFN12—3——4——5—6—7—8PAD

16-Pin SOIC (Wide)123456710111213141516—

SymbolNCIN ANCGNDGNDNCIN BNCNCOUT BOUT BVDDVDDOUT AOUT ANCNC

No connectionInput ANo connectionGroundGroundNo connectionInput BNo connectionNo connectionOutput BOutput BSupply inputSupply inputOutput AOutput ANo connectionExposed Metal Pad

Description

The descriptions of the pins are listed in Table3-1.

TABLE 3-1:

8-Pin PDIP

12—3——4——5—6—7—8—Note1:

Duplicate pins must be connected for proper operation.

3.1Inputs A and B3.4Ground (GND)

Inputs A and B are TTL/CMOS compatible inputs thatcontrol outputs A and B, respectively. These inputshave 300mV of hysteresis between the high and lowinput levels, allowing them to be driven from slow risingand falling signals, and to provide noise immunity.Ground is the device return pin. The ground pin shouldhave a low-impedance connection to the bias supplysource return. High peak currents will flow out theground pin when the capacitive load is beingdischarged.

3.2Outputs A and B3.5Exposed Metal Pad

Outputs A and B are CMOS push-pull outputs that arecapable of sourcing and sinking 3A peaks of current(VDD = 18V). The low output impedance ensures thegate of the external MOSFET will stay in the intendedstate even during large transients. These outputs alsohave a reverse current latch-up rating of 1.5A.

The exposed metal pad of the DFN package is notinternally connected to any potential. Therefore, thispad can be connected to a ground plane or othercopper plane on a printed circuit board to aid in heatremoval from the package.

3.3

Supply Input (VDD)

VDD is the bias supply input for the MOSFET driver andhas a voltage range of 4.5V to 18V. This input must bedecoupled to ground with a local ceramic capacitor.This bypass capacitor provides a localized low-impedance path for the peak currents that are to beprovided to the load.

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TC4423A/TC4424A/TC4425A

4.0

APPLICATIONS INFORMATION

VDD = 18V1µFWIMA MKS-2

Input

TC4423A(1/2 TC4425A)

VDD = 18V0.1µFCeramicOutput CL = 1800pF

Input

TC4424A(1/2 TC4425A)

1µFWIMA MKS-2

0.1µFCeramicOutput CL = 1800pF

Input: 100kHz, square wave,

tRISE = tFALL ≤ 10ns

+5VInput0V18VOutput

10%

tD190%

tD2

90%

0V18VOutput

90%

+5VInput

10%

Input: 100kHz, square wave,

tRISE = tFALL ≤ 10ns

90%

tD190%10%

tD2

90%

10%FIGURE 4-1:Time.

Inverting Driver Switching

FIGURE 4-2:Switching Time.

Non-inverting Driver

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TC4423A/TC4424A/TC4425A

5.0

5.1

PACKAGING INFORMATION

Package Marking Information (Not to Scale)

8-Lead DFN (6x5)

Example:

XXXXXXXXXXXXXXXXYYWWNNNTC4423Ae3VMF^^05202568-Lead PDIP (300 mil)

XXXXXXXXXXXXXNNNYYWWExample:

TC4423AVe3PA^^25605208-Lead SOIC (150 mil)

XXXXXXXXXXXXYYWWNNNExample:TC4423AVOA^^0520e325616-Lead SOIC (300 mil)Example:

XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXYYWWNNNTC4423AVOE^^e30420256Legend:XX...XYYYWWNNNe3 *Customer-specific informationYear code (last digit of calendar year)Year code (last 2 digits of calendar year)Week code (week of January 1 is week ‘01’)Alphanumeric traceability codePb-free JEDEC designator for Matte Tin (Sn)This package is Pb-free. The Pb-free JEDEC designator ( )e3can be found on the outer packaging for this package.Note:In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.© 2007 Microchip Technology Inc.DS21998B-page 11

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TC4423A/TC4424A/TC4425A

8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S] PUNCHSINGULATEDNote:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingDD1NbeNKLEE1EXPOSEDPADNOTE 112D2TOP VIEWφBOTTOM VIEW21E2NOTE 1AA1A2A3NOTE 2UnitsDimension LimitsNumber of PinsPitchOverall HeightMolded Package ThicknessBase ThicknessOverall LengthMolded Package LengthExposed Pad LengthOverall WidthMolded Package WidthExposed Pad WidthContact WidthContact LengthContact-to-Exposed PadModel Draft Angle TopNeAA2A3DD1D2EE1E2bLKφ2.160.350.500.20–3.85––0.00MINMILLIMETERSNOM81.27 BSC0.850.650.010.20 REF4.92 BSC4.67 BSC4.005.99 BSC5.74 BSC2.310.400.60––2.460.470.75–12°4.151.000.800.05MAXStandoff A1Notes:1.Pin 1 visual index feature may vary, but must be located within the hatched area.2.Package may have one or more exposed tie bars at ends.3.Dimensioning and tolerancing per ASME Y14.5M.BSC:Basic Dimension. Theoretically exact value shown without tolerances.REF:Reference Dimension, usually without tolerance, for information purposes only.MicrochipTechnologyDrawingC04-113BDS21998B-page 12© 2007 Microchip Technology Inc.

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TC4423A/TC4424A/TC4425A

8-Lead Plastic Dual In-Line (PA) – 300 mil Body [PDIP]Note:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingNNOTE 1E112D3EA2AA1eb1bLceBUnitsDimension LimitsNumber of PinsPitchTop to Seating PlaneMolded Package ThicknessBase to Seating PlaneShoulder to Shoulder WidthMolded Package WidthOverall LengthTip to Seating PlaneLead ThicknessUpper Lead WidthLower Lead WidthNeAA2A1EE1DLcb1b–.115.015.290.240.348.115.008.040.014MININCHESNOM8.100 BSC–.130–.310.250.365.130.010.060.018.210.195–.325.280.400.150.015.070.022MAXOverall Row Spacing §eB––.430Notes:1.Pin 1 visual index feature may vary, but must be located with the hatched area.2.§ Significant Characteristic.3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010\" per side.4.Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.MicrochipTechnologyDrawingC04-018B© 2007 Microchip Technology Inc.DS21998B-page 13

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TC4423A/TC4424A/TC4425A

8-Lead Plastic Small Outline (OA) – Narrow, 3.90 mm Body [SOIC]Note:For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingDeNEE1NOTE 1123bhφchαAA2A1LL1βUnitsDimension LimitsNumber of PinsPitchOverall HeightMolded Package ThicknessStandoff §Overall WidthMolded Package WidthOverall LengthChamfer (optional)Foot LengthFootprintFoot AngleLead ThicknessLead WidthMold Draft Angle TopMold Draft Angle BottomNeAA2A1EE1DhLL1φcbαβ0°0.170.315°5°0.250.40–1.250.10MINMILLIMETERSNOM81.27 BSC–––6.00 BSC3.90 BSC4.90 BSC––1.04 REF–––––8°0.250.5115°15°0.501.271.75–0.25MAXNotes:1.Pin 1 visual index feature may vary, but must be located within the hatched area.2.§ Significant Characteristic.3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.4.Dimensioning and tolerancing per ASME Y14.5M.BSC:Basic Dimension. Theoretically exact value shown without tolerances.REF:Reference Dimension, usually without tolerance, for information purposes only.MicrochipTechnologyDrawingC04-057BDS21998B-page 14© 2007 Microchip Technology Inc.

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TC4423A/TC4424A/TC4425A

16-Lead Plastic Small Outline (OE) – Wide, 7.50 mm Body [SOIC]Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingDNEE1NOTE 1123bhAA2φcehαLA1L1βUnitsDimension LimitsNumber of PinsPitchOverall HeightMolded Package ThicknessStandoff §Overall WidthMolded Package WidthOverall LengthChamfer (optional)Foot LengthFootprintFoot AngleLead ThicknessLead WidthMold Draft Angle TopNeAA2A1EE1DhLL1φcbα0°0.200.315°0.250.40–2.050.10MINMILLIMETERSNOM161.27 BSC–––10.30 BSC7.50 BSC10.30 BSC––1.40 REF––––8°0.330.5115°0.751.272.65–0.30MAXMold Draft Angle Bottomβ5°–15°Notes:1.Pin 1 visual index feature may vary, but must be located within the hatched area.2.§ Significant Characteristic.3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.4.Dimensioning and tolerancing per ASME Y14.5M.BSC:Basic Dimension. Theoretically exact value shown without tolerances.REF:Reference Dimension, usually without tolerance, for information purposes only.MicrochipTechnologyDrawingC04-102B© 2007 Microchip Technology Inc.DS21998B-page 15

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TC4423A/TC4424A/TC4425A

NOTES:

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TC4423A/TC4424A/TC4425A

APPENDIX A:

REVISION HISTORY

Revision B (April 2007)

•Correct numerous errors throughout document.•Page 3: Added Package Power Dissipation information about DC Characteristic Table.

•Page 3: Added Note 3 to DC Characteristic Table.•Page 4: Changed Thermal Resistance for8L-PDIP device from 125 to 84.6.

Changed Thermal Resistance for 8L-SOIC from 155 to 163.

•Page 12: Updated Package Outline Drawing.•Page 13: Updated Package Outline Drawing.•Page 14: Updated Package Outline Drawing.•Page 15: Added 16-Lead SOIC Package Outline Drawing

•Page 17: Updated Revision History.

Revision A (June 2006)

•Original Release of this Document.

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TC4423A/TC4424A/TC4425A

NOTES:

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TC4423A/TC4424A/TC4425A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.PART NO.Device

Device:

TC4423A: 3A Dual MOSFET Driver, Inverting

TC4424A: 3A Dual MOSFET Driver, Non-InvertingTC4425A: 3A Dual MOSFET Driver, ComplementaryV

-40°C to +125°C

XTemperatureRange

XXPackage

XXXTape & Reel

Examples:a)

TC4423AVOA:

3A Dual InvertingMOSFET Driver,8LD SOIC package.3A Dual InvertingMOSFET Driver,8LD PDIP package.3A Dual InvertingMOSFET Driver,8LD DFN package.3A Dual InvertingMOSFET Driver,

16LD SOIC package.

b)TC4423AVPA:

c)TC4423AVMF:

Temperature Range:Package: *

MF=Dual, Flat, No-Lead (6x5 mm Body), 8-leadMF713=Dual, Flat, No-Lead (6x5 mm Body), 8-lead

(Tape and Reel)

OA=Plastic SOIC (150 mil Body), 8-LeadOA713=Plastic SOIC (150 mil Body), 8-Lead

(Tape and Reel)

OE=Plastic SOIC (Wide Body), 16-leadOE713=Plastic SOIC (Wide Body), 16-lead

(Tape and Reel)

PA=Plastic DIP, (300 mil body), 8-lead* All package offerings are Pb Free (Lead Free)

TC4423AVOE:

TC4424AVOA713:3A Dual Non-Inverting,

MOSFET Driver,8LD SOIC package,Tape and Reel.TC4424AVPA:

3A Dual Non-Inverting,MOSFET Driver,8LD PDIP package.3A Dual Complementary,MOSFET Driver,8LD SOIC package.3A Dual Complementary,MOSFET Driver,8LD PDIP package.

a)TC4425AVOA:

b)TC4425AVPA:

TC4425AVOE713:3A Dual Complementary,

MOSFET Driver,

16LD SOIC package,Tape and Reel.

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TC4423A/TC4424A/TC4425A

NOTES:

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Note the following details of the code protection feature on Microchip devices:•••

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

••

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PROMATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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12/08/06

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