Methods of forming patterns on a substrate

专利名称：Methods of forming patterns on a substrate发明人：Joong-hyuk Kim,Sung-gyu Kang,Seung-ho

Lee,Jae-woo Chung,Young-ki Hong

申请号：US13448438申请日：20120417公开号：US09018036B2公开日：20150428

专利附图：

摘要：A method of forming patterns on a substrate, the method including: placing amask having an opening defining a portion of one surface of a substrate on whichpatterns are to be formed on the substrate; forming a first modification layer in the

opening by ejecting a surface modification ink onto a surface of the substrate throughthe opening; ejecting a target ink having droplets of sizes larger than those of a surfacemodification ink such that the target ink is distributed on the first modification layer inthe opening; and removing the mask.

申请人：Joong-hyuk Kim,Sung-gyu Kang,Seung-ho Lee,Jae-woo Chung,Young-ki Hong

地址：Seoul KR,Gyeonggi-do KR,Gyeonggi-do KR,Gyeonggi-do KR,Gyeonggi-do KR

国籍：KR,KR,KR,KR,KR

代理机构：Harness, Dickey & Pierce, P.L.C.

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