Method and mounting device for mounting a componen

专利名称：Method and mounting device for mounting a

component at a specific position

发明人：Sakurai, Hiroshi申请号：EP94120727.6申请日：19941227公开号：EP0660657A1公开日：19950628

专利附图：

摘要：The present invention relates to a method for mounting a component at aspecific position, specifically a chip component on a substrate such as a printed circuitboard comprising the steps of picking up the component through a pick-up nozzle from

a component supply unit, transferring the component and placing same in a detectionarea of an optical detecting means for detecting a deviation of the component beingpicked up from a predetermined component position relative to the pick-up nozzle andmounting the component at the desired position. Moreover the present invention relatesto a mounting device for mounting a component at a specific position comprising amovable mounting head unit supporting at least one pick-up nozzle for picking up atleast one component from a component supply unit, a position detecting means fordetecting a deviation of the picked up component from a predetermined position relativeto the pick-up nozzle and correction value calculating means for calculating correctionvalues for correcting a predetermined mounting position of the pick-up nozzle inresponse to said deviation. The method is improved by the step of changing the

predetermined pick up position of the pick-up nozzle for the component to be picked upnext in response to said deviation detected. Accordingly the mounting device is improvedin that a pick up point changing means is provided for changing the predetermined pickup point of the pick-up nozzle in response to said correction values.

申请人：YAMAHA HATSUDOKI KABUSHIKI KAISHA

地址：2500 Shingai Iwata-shi Shizuoka-ken, 438 JP

国籍：JP

代理机构：Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät

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