Method to pattern a substrate

专利名称：Method to pattern a substrate发明人：Jonathan Walford,Per Askebjer,Robert

Eklund

申请号：US10634152申请日：20030804公开号：US071886B2公开日：20070306

摘要：An aspect of the present invention includes a method of lithography to enhanceuniformity of critical dimensions of features patterned onto a workpiece. Said workpieceis coated with a coating sensitive to electromagnetic radiation. An electromagneticradiation source having an illumination intensity is provided. At least one object pixel ofelectromagnetic radiation is created. A predetermined pattern is exposed, by using saidat least one object pixel, on at least a portion of said workpiece in a first exposure passwith a first dose to provide less than full exposure of said coating sensitive to

electromagnetic radiation. Said exposing action is repeated at least until said portion ofsaid coating sensitive to electromagnetic radiation is fully exposed, wherein said dose isincreased for every following pass. Said fully exposed coating sensitive toelectromagnetic radiation is developed.

申请人：Jonathan Walford,Per Askebjer,Robert Eklund

地址：Solna SE,Åkersberga SE,Stockholm SE

国籍：SE,SE,SE

代理机构：Haynes Beffel & Wolfeld LLP

代理人：Ernest J. Beffel, Jr.

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